Consulting advice regarding microelectronic packaging concerns and issues.
- Clearance constraint and minimum tolerance considerations for wirebonding your chip.
- Package / Socket selection advice.
- Wirebonder equipment, diagnostics and trouble shooting.
- Application diagnostics and trouble shooting.
- Chip to PCB advice, including bond padframe considerations.
- Hybrid packaging advice
- Other packaging questions and issues.
For more info please contact Brendan Casey