Consulting advice regarding microelectronic packaging concerns and issues.

• Clearance constraint and minimum tolerance considerations for wirebonding your chip.
• Package / Socket selection advice.
• Wirebonder equipment, diagnostics and trouble shooting.
• Application diagnostics and trouble shooting.
• Chip to PCB advice, including bond padframe considerations.
• Hybrid packaging advice
• Other packaging questions and issues.

For more info please contact Brendan Casey