Consulting advice regarding microelectronic packaging concerns and issues.

  • Clearance constraint and minimum tolerance considerations for wirebonding your chip.
  • Package / Socket selection advice.
  • Wirebonder equipment, diagnostics and trouble shooting.
  • Application diagnostics and trouble shooting.
  • Chip to PCB advice, including bond padframe considerations.
  • Hybrid packaging advice
  • Other packaging questions and issues.


For more info please contact Brendan Casey

Semiconducter Packaging in Southeastern Michigan