Currently Available

• Chip to package
• Chip to printed circuit board.
• Chip to chip, or Hybrid wirebonding.
• Aluminum or Gold wedge wirebonding
• Quick turnaround available in most cases. Rush service available upon request.

 

• Sensors
• MEMS
• Circuits
• Feedback
• Local pickup and drop-off services available upon request.

 

For more info, please contact Brendan Casey